Multilayer Ml8–Logic and power on same pcb with fine pitch - Produs

 MODENA  -  Italia
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Multilayer Ml8–Logic and power on same pcb with fine pitch
  • Multilayer Ml8–Logic and power on same pcb with fine pitch
Application: Automotive hybrid car
Technology: Multilayer Ml8–Logic and power on same pcb with fine pitch
Layup: Mixed copper thickness 210 µm, 35 µm in the innerlayer and 105 µm on outer layer
Material: Fr4 High Tg with filler Iteq IT180A

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Application: Automotive hybrid car
Technology: Multilayer Ml8–Logic and power on same pcb with fine pitch
Layup: Mixed copper thickness 210 µm, 35 µm in the innerlayer and 105 µm on outer layer
Material: Fr4 High Tg with filler Iteq IT180A
Finishing: Enig
 

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